Keerthi Kamath (B.S., Mechanical Science and Engineering)
Email: kkamath2@illinois.edu
I am an undergraduate student pursuing a B.S. in Mechanical Engineering, with an expected graduation date of 2023. I joined the WPM Lab in January 2021, and I have been working with Ph.D. student Ignacio Arretche to study the composition of 3D printed materials developed with binder jetting technology. In my free time, I enjoy art, horror movies, and playing with my pet guinea pig.
Madison Yang (B.S., Mechanical Science and Engineering)
Email: mcy2@illinois.edu
I joined the WPM lab in the Fall of 2020 where I worked with Changgong Kim to create an educational module for Engineering Open House which explained the basic concepts of Ultrasonic Non-Destructive Evaluation (NDE). I am currently working on using ultrasonic NDE to evaluate the mechanical properties of binder jet printed parts. Outside of the lab, I am the chassis sub-team lead for the Off-Road Illini and am hoping to graduate in May 2023 with a B.S. in mechanical engineering and a minor in mathematics.